Laminates for efficient designs of power amplifiers

The Advanced Circuit Materials Division (ACM) from Rogers Corporation presents its RO4360 ™ laminates developed for the special requirements of designers of high frequency amplifiers. RO4360 laminates have the characteristic of a dielectric constant of 6.15 and a loss of 0.003 @ 2.5 GHz

The laminates are based on a system filled with ceramic thermal resin reinforced with fiberglass for excellent mechanical stability compared with PTFE glass cloth.

RO4360 laminates provide the operation and trust that designers need a comprehensive solution with the lowest PCB. Prepared under the successful legacy of RO4350B ™ laminate materials, new product features low dissipation factor, good capacity of energy management and improved thermal conductivity.

The friendly materials RO4360 environment, comply with the RoHS Directive and are compatible with standard processing methods for printed circuit boards. Copper clad laminates exhibit high glass transition temperature (Tg) greater than 280 º C and a low coefficient of thermal expansion (CTE) in the z axis (30 ppm / º C) needed to ensure PTHs multilayer circuits (plated through holes).

RO4360 laminates allow designers to reduce the size of the circuit are critical in applications where size and cost. They are a good choice for engineers working on designs including power amplifiers, panel antennas, and other commercial applications of high frequency.