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ACE™ MX - MIMO Channel Emulator for Broadband Wireless

Emulador de canal ACEpAzimuth Systems Inc. presents the ACE MX product line. An easy-to-use family of fully-featured channel emulators designed to accurately create complex fading channels for testing the most advanced wireless technology and devices. .

 

Read more: ACE™ MX - MIMO Channel Emulator for Broadband Wireless

Agilent Technologies Introduces Oscilloscopes with Industry's Biggest Display, Hardware-Accelerated "Search and Navigate" Capability

Nuevos modelos de osciloscoAgilent Technologies Inc. (NYSE: A) today added 14 new models to its InfiniiVision 7000 Series mixed-signal and digital-storage oscilloscope portfolio.

Read more: Agilent Technologies Introduces Oscilloscopes with Industry's Biggest Display, Hardware-Accelerated "Search and Navigate" Capability

 

BPG 32G-Quad and 56G-Dual syncronized for 100GbE

BPG 32G QuadpSHF Communications Technologies introduces the worlds only synchronized Quad-Channel 32 Gbps and Dual-Channel 56 Gbps BERT system.

Read more: BPG 32G-Quad and 56G-Dual syncronized for 100GbE

On field meter with touchscreen

Medidor de campo con pantalIkusi just launched a new concept of gauge field: the DSA Touch, the first touch-screen meter on the market.

Read more: On field meter with touchscreen

 

Innovative Integration’s New X6-RX PCIe XMC Module with Xilinx Virtex-6

X6-RXInnovative Integration Inc, announces the X6-RX. The X6-RX is a flexible receiver that integrates IF digitizing with signal processing on an XMC IO module.

Read more: Innovative Integration’s New X6-RX PCIe XMC Module with Xilinx Virtex-6

Roke Launches World First in High Voltage Testing

The new service can accommodate Radio Frequency (RF) power and voltage on a massive scale. It combines high voltage isolation with screening to 18 GHz, whereby most other facilities only allow for testing at 50 Hz or at low voltage.

Read more: Roke Launches World First in High Voltage Testing

 

Undetected Pressure Variations in Flip Chip Assembly Reduce Yields and Raise Cost

Prod22

Pressurex® Sensor Film Needed to Measure Contact Pressure Variations Across Flip Chip Dies and Bonding Tools.

Undetected bonding pressure variations can result in poor or open flip chip connections, reducing yield and long-term reliability while raising costs

Read more: Undetected Pressure Variations in Flip Chip Assembly Reduce Yields and Raise Cost

Lowest power RISC solutions and high portability for industrial applications

Prod28Avalue, distributed by Venco Electronica, announces new modules for embedded computing with highly scalable RISC architecture and incorporating the latest technology-based microcontrollers ARM9, ARM11 and Cortex-A8,

Read more: Lowest power RISC solutions and high portability for industrial applications

 

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